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- Compact Universal BGA Reballing Stencil for P...
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Numéro d'article:
228106567
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Numéro d'article:
228106567
HTG 1929
Price Details
Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )
*All items will import from Royaume-Uni
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Importé depuis la boutique UK
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Nos meilleurs partenaires logistiques
Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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rapide
Retour
gratuit*
Emballage sécurisé
Produits 100 % originaux
Conformité PCI DSS
Certifié ISO 27001
Note: Step Up Voltage Transformer required for using electronics products of Royaume-Uni store (230 V). Recommended power converters Acheter maintenant.
Ce qui se démarque
Compact Design
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
High-Quality Material
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.
Détails du produit
- [FOUR PITCHES] Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
- [PRECISE POSITIONING] Tin mesh solder template allows fast and precise tin implantation without shifting under high temperatures, making reballing effortless and efficient.
- [COMPACT APPEARANCE] With a and compact design, the BGA reballing stencil is portable and easy to use, providing convenience without compromising on quality.
- [VERSATILE USAGE] This stencil is suitable for a variety of common IC chips found in phones today, meeting all your reballing needs with its wide compatibility.
- [DURABLE MATERIAL] Crafted from premium stainless steel, the tin mesh solder template boasts durability and longevity, ensuring reliable performance for long-term use.
| Brand | Eminchu |
| Included Components | no |
| Model Number | Eminchu8g43mcizpy (2141.2 cm) |
| Part Number | Eminchu8g43mcizpy (2141.2 cm) |
| Unit Count | 1.0 count |
| Country of Origin | China |
| Manufacturer | Eminchu |
| Item Weight | 1 lbs (450 grams) |
À qui est-ce destiné ?
-
Mobile Repair Technicians
Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.
-
DIY Electronics Enthusiasts
Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.
-
Small Repair Shops
Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.
-
Mass Production Facilities
Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.
-
Amateur Hobbyists
Not recommended for beginners who may struggle with the precision required for effective BGA reballing without experience.
-
General Consumer Use
Not for everyday consumers as it requires technical skills beyond basic user capabilities for effective application.
DESCRIPTION DU PRODUIT
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Questions et réponses des clients
-
question:
What pitch options does the stencil offer?
répondre: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm. -
question:
Is the stencil easy to transport?
répondre: Yes, the compact and elegant design makes it portable and easy to use. -
question:
What materials is the stencil made from?
répondre: The stencil is made from premium stainless steel, ensuring durability and longevity.
Eminchu Templates Eminchu8g43mcizpy (2141.2 cm) Editorial Review
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HTG 1929
Commandez maintenant et recevez votre commande aux alentours du Mercredi, Août 05
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
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PCI DSS compliant and ISO 27001:2022 certified, with encrypted payments and full buyer protection on every order.
Nos meilleurs partenaires logistiques
Livraison transfrontalière la plus rapide
Caractéristiques et avantages
- Four pitch options for versatile and accurate soldering.
- Fast and precise tin implantation without displacement.
- Elegant, compact, and portable design for easy use.
- Compatible with a variety of common IC chips.
- Crafted from durable stainless steel for long-term reliability.
- Ideal for efficient BGA IC chip repair.
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